Wet-to-Wet all-wet process reduces equipment footprint, prevents oxidation, and enhances copper adhesion.
Process Type
Wet-to-Wet
Desmear Capability
High Speed
PTH Chemistry
Inpulse2
Detail Section 01
Drying-Free Horizontal Flash Plating
Eliminates unnecessary drying steps in traditional processes, reducing production line length by 30% and physically preventing oxidation.
Detail Section 02
Modular Flexible Configuration
Supports free combination of desmear, electroless copper, and flash plating modules, adapting to the full process range from flexible boards to ultra-thick boards.
