Designed specifically for ultra-thick boards up to 6.5mm. Utilizing segmented pulse electric field technology, it overcomes the mass transfer dead zone at an aspect ratio of 40:1, achieving stable throwing power (TP) ≥ 90%.
Maximum Board Thickness
6.5 mm
Maximum Aspect Ratio
40:1
Throwing Power
TP ≥ 90%
Detail Section 01
16-Step Waveform Regulation Logic
The digital rectification system supports precise forward (0-15000ms) and reverse (0-150ms) settings, effectively resolving the shielding effect in thick boards.
Detail Section 02
High-Flow Forced Through-Flow Field
For 6.5mm deep holes, a bottom inlet pipe combined with offset side nozzles is adopted to force fluid exchange within the deep hole, eliminating concentration gradients.
Detail Section 03
DuPont PPR3 Collaborative Design
As a strategic partner, we design a dedicated flow field model for the PPR3 chemistry to maximize the performance of pulse additives.
Detail Section 04
Logic Second-Level Breakpoint Reset
Logic second-level breakpoint reset enables phase logic recovery within seconds after an unexpected failure. There is no need to drain the high-value AI boards from the tank, minimizing the risk of scrap.
