VCP-JADA SOLUTION

Range: VCP Series

MVCP Ultra-thin Frameless Series

Pushing the physical limit of 0.036mm to set the high-yield metallization standard for 1.6T optical communication and super flagship smartphones.

Board Thickness Range：0.036-2.4mm

Aspect Ratio (AR)：8:1 / 10:1

Replacement Rate：10 TO/hr

Yield：99.8%

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Range: VCP Series

HVCP HDI Via Fill Series

Designed for mass micro blind via filling, achieving an 80% increase in throughput and a 50% reduction in floor space occupancy.

Via Filling Capability：Micro-Vias

Throughput Density：+80%

Tank Width：370mm

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Range: VCP Series

PVCP Pulse Deep Hole Series

Designed specifically for ultra-thick boards up to 6.5mm. Utilizing segmented pulse electric field technology, it overcomes the mass transfer dead zone at an aspect ratio of 40:1, achieving stable throwing power (TP) ≥ 90%.

Maximum Board Thickness：6.5 mm

Maximum Aspect Ratio：40:1

Throwing Power：TP ≥ 90%

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